适用于微电子学中硅耦合的硼硅酸盐玻璃的线性热膨胀系数（130 - 800 K）
Linear thermal expansion coefficient (at temperatures from 130 to 800 K) of borosilicate glasses applicable for coupling with silicon in microelectronics
摘要：
本文介绍了对LK 5和Borofloat 33两种硼硅酸盐玻璃的线性热膨胀系数和线性热膨胀的测量处理结果。使用热机械分析仪TMA 7100在130至800 K（-143至526 $°$ C）的温度范围内测定了玻璃样品的线性热膨胀。间接测量的两种玻璃品牌的线性热膨胀系数和线性热膨胀的相对不精确度分别小于$\pm$ 5%和$\pm$ 3%。多项式方程，近似所获得的测量的温度依赖性，提出。研究结果将有助于模拟微系统工程中采用硅-玻璃阳极键合工艺制造的器件的特性，也可用于优化硅-玻璃键合工艺的温度控制。关键词：线膨胀，热膨胀系数，热机械分析，硼硅酸盐玻璃。
英文摘要：
Processing results of measurements of linear thermal expansion coefficients and linear thermal expansion of two brands of borosilicate glasses --- LK5 and Borofloat 33 --- are presented. The linear thermal expansion of glass samples have been determined in the temperature range 130 to 800 K (minus 143 to 526 $°$C) using thermomechanical analyzer TMA7100. Relative imprecision of indirectly measured linear thermal expansion coefficients and linear thermal expansion of both glass brands is less than $\pm$5 % and $\pm$3 % respectively. Polynomial equations, approximating temperature dependence of obtained measurements, are presented. The results will facilitate the modeling of the characteristics of the devices which are used in microsystems engineering and fabricated by anodic bonding of silicon to glass, they can also be used to optimize the temperature regime of silicon to glass bonding process. Keywords: linear expansion, thermal expansion coefficient, thermomechanical analysis, borosilicate glass.
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