用于具有封装内存储器栈的多芯片系统的节能无线互连框架
Energy-Efficient Wireless Interconnection Framework for Multichip Systems with In-package Memory Stacks
摘要：
具有存储器堆栈和各种处理芯片的多芯片系统是基于平台的设计（例如服务器和嵌入式系统）的核心。要充分利用这些集成多芯片系统的优势，需要一个无缝的、可扩展的封装内互连框架。然而，最先进的芯片间通信需要长的有线信道，这增加了能耗和延迟，同时降低了数据带宽。在这里，我们提出了一个节能，无缝无线互连网络的多芯片系统的设计。我们证明与周期精确的模拟，这样的设计降低了能耗和延迟，同时增加了带宽相比，现代多芯片集成系统。
英文摘要：
Multichip systems with memory stacks and various processing chips are at the heart of platform based designs such as servers and embedded systems. Full utilization of the benefits of these integrated multichip systems need a seamless, and scalable in-package interconnection framework. However, state-of-the-art inter-chip communication requires long wireline channels which increases energy consumption and latency while decreasing data bandwidth. Here, we propose the design of an energy-efficient, seamless wireless interconnection network for multichip systems. We demonstrate with cycle-accurate simulations that such a design reduces the energy consumption and latency while increasing the bandwidth in comparison to modern multichip integration systems.
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