面向片上微声电路：基于高对比度声波倏逝波限制的元件评估
Toward Microphononic Circuits on Chip: An Evaluation of Components based on High-Contrast Evanescent Confinement of Acoustic Waves
摘要：
我们研究了不需要悬浮的固体平面结构中的微米级声波元件和芯片上电路的前景。我们利用高慢度对比材料容易在硅互补金属氧化物半导体（CMOS）工艺中获得的声波的倏逝波引导。高慢度对比度提供了微米级结构中GHz频率声场的强限制。我们解决的基本影响的内在材料和辐射损耗的工作频率，带宽，设备的大小，并作为一个结果的实用性，基于固体嵌入式波导的多元件微声子电路。我们表明，一个家庭的声学组件的基础上渐逝引导声波，包括波导弯曲，倏逝波耦合器，Y-分裂器，和声波microwave谐振器，可以实现在紧凑的，微米级的结构，并提供基本的缩放和性能参数的基础上，这些组件的材料特性和模拟。我们进一步发现，预期波传播损耗允许高品质因数（Q）、窄带谐振器和传播长度，其允许延迟线和多个组件的耦合或级联以形成功能电路，在芯片上的引导声学信号处理中具有潜在的实用性。我们还解决和模拟弯曲和辐射损耗，提供深入了解路由和谐振器。这种电路可以与电子和光子电路单片集成在单个芯片上，具有扩展的能力。
英文摘要：
We investigate the prospects for micron-scale acoustic wave components and circuits on chip in solid planar structures that do not require suspension. We leverage evanescent guiding of acoustic waves by high slowness contrast materials readily available in silicon complementary metal-oxide semiconductor (CMOS) processes. High slowness contrast provides strong confinement of GHz frequency acoustic fields in micron-scale structures. We address the fundamental implications of intrinsic material and radiation losses on operating frequency, bandwidth, device size and as a result practicality of multi-element microphononic circuits based on solid embedded waveguides. We show that a family of acoustic components based on evanescently guided acoustic waves, including waveguide bends, evanescent couplers, Y-splitters, and acoustic-wave microring resonators, can be realized in compact, micron-scale structures, and provide basic scaling and performance arguments for these components based on material properties and simulations. We further find that wave propagation losses are expected to permit high quality factor (Q), narrowband resonators and propagation lengths allowing delay lines and the coupling or cascading of multiple components to form functional circuits, of potential utility in guided acoustic signal processing on chip. We also address and simulate bends and radiation loss, providing insight into routing and resonators. Such circuits could be monolithically integrated with electronic and photonic circuits on a single chip with expanded capabilities.
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