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arXiv 1503.05862cond-mat.mes-hallcond-mat.mtrl-sci
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非掺杂Si/SiGe异质结迁移率限制机制的研究

Investigation of Mobility Limiting Mechanisms in Undoped Si/SiGe Heterostructures

X. Mi, T. M. Hazard, C. Payette, K. Wang, D. M. Zajac, J. V. Cady, J. R. Petta

摘要:

我们进行详细的磁输运的二维电子气(2DEG)在未掺杂的Si/SiGe异质结构中形成的研究,以确定在这个日益重要的材料系统中的电子迁移率限制机制。通过分析来自26个具有不同异质结生长轮廓的晶片的数据,我们观察到Si量子阱中的背景氧浓度与最大迁移率之间的强相关性。最高质量的晶片支持2DEG,其迁移率为160,000 cm^2/Vs,密度为2.17 x 10^11/cm^2,并在临界密度为0.46 x 10^11/cm^2时表现出金属到绝缘体的转变。在1.8 T的磁场下,我们提取了约150微eV的谷分裂。这些结果表明,未掺杂的Si/SiGe异质结构适合于制备少电子量子点。

英文摘要:

We perform detailed magnetotransport studies on two-dimensional electron gases (2DEGs) formed in undoped Si/SiGe heterostructures in order to identify the electron mobility limiting mechanisms in this increasingly important materials system. By analyzing data from 26 wafers with different heterostructure growth profiles we observe a strong correlation between the background oxygen concentration in the Si quantum well and the maximum mobility. The highest quality wafer supports a 2DEG with a mobility of 160,000 cm^2/Vs at a density 2.17 x 10^11/cm^2 and exhibits a metal-to-insulator transition at a critical density 0.46 x 10^11/cm^2. We extract a valley splitting of approximately 150 microeV at a magnetic field of 1.8 T. These results provide evidence that undoped Si/SiGe heterostructures are suitable for the fabrication of few-electron quantum dots.

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