Considering a copper wire heated by Joule effect and the variation of its resistivity and specific heat with temperature, we established numerical and analytical solutions (between 293 and 1356 K for the latter) for the evolution of its temperature over time. The Temperature vs. Time evolution follows a Lambertian function. The calculations are based on the assumption of adiabatic heating and uniform current distribution within the wire. We demonstrate that at very low temperature the heating rate is strongly dependent on copper purity.
Electronic Signature of Melting Onset in Polycrystalline Copper at Extreme Conditions
Stanford University（斯坦福大学）；RPTU University Kaiserslautern-Landau（凯泽斯劳滕-兰道理工大学）；SLAC National Accelerator Laboratory（SLAC国家加速器实验室）；Bundeswehr University Munich（德国联邦国防军慕尼黑大学）；University of Warwick（华威大学）
Leveraging rapid sintering to retain metastable zirconia in copper
Nanyang Technological University（南洋理工大学）；Shanghai Jiao Tong University（上海交通大学）；Singapore Centre for 3D Printing, Nanyang Technological University（南洋理工大学三维打印中心）；Department of Civil Engineering, TongJi ZheJiang College（同济大学浙江学院土木工程系）
Probing the atomic dynamics of ultrafast melting with femtosecond electron diffraction
SLAC National Accelerator Laboratory（SLAC国家加速器实验室）；Bundeswehr University Munich（德国联邦国防军慕尼黑大学）；RPTU Kaiserslautern-Landau（莱茵兰-普法塔尔技术凯泽斯劳滕-兰道大学）；University of Duisburg-Essen（杜伊斯堡-埃森大学）；TU Dortmund University（多特蒙德工业大学）；University of Warwick（华威大学）
Development and validation of an electron temperature-dependent interaction potential for silicon and copper for the use in atomistic simulations of laser ablation
Unveiling temperature and phase boundaries in laser-driven shocked and released copper: insights from ultra-fast X-ray Absorption Spectroscopy up to 300 GPa
