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arXiv 1503.00554cond-mat.mes-hallcond-mat.mtrl-sciphysics.optics
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锥形槽中的间隙和沟道等离子体激元

Gap and channelled plasmons in tapered grooves: a review

Cameron L. C. Smith, Nicolas Stenger, Anders Kristensen, N. Asger Mortensen, Sergey I. Bozhevolnyi

摘要:

锥形金属凹槽已经被证明可以支持等离子体激元-金属-电介质界面处的自由电子的电磁耦合振荡-跨越各种配置和V形轮廓。这种等离子体激元可以分为两类:间隙表面等离子体激元(GSPs),其被横向限制在锥形凹槽侧壁之间并且沿着凹槽轴线或垂直于平面表面传播;以及通道等离子体激元(CPP),其占据锥形凹槽轮廓并且仅沿着凹槽轴线传播。GSP和CPP都具有各种独特的特性,非常适合广泛的尖端纳米等离子体技术,包括超紧凑光子电路,量子光学组件,增强型芯片实验室设备,高效的光吸收表面和先进的光学滤波器,同时还提供了一个利基平台来探索等离子体激发及其相互作用的基础科学。在这篇综述中,我们提供了锥形凹槽中等离子体激元的研究现状更新,首先介绍了GSPs和CPP的理论和重要特征,然后概述了它们能够或改进的广泛应用。我们涵盖了可以制造锥形槽结构的技术,特别是强调晶圆级生产方法,并概述了各种基于光子和电子的方法,可用于发射和研究GSP和CPP。最后,我们讨论了进一步开发等离子体锥形槽设备所面临的挑战,并考虑了这一选择但可能影响深远的主题领域所提供的未来方向。

英文摘要:

Tapered metallic grooves have been shown to support plasmons -- electromagnetically coupled oscillations of free electrons at metal-dielectric interfaces -- across a variety of configurations and V-like profiles. Such plasmons may be divided into two categories: gap-surface plasmons (GSPs) that are confined laterally between the tapered groove sidewalls and propagate either along the groove axis or normal to the planar surface, and channelled plasmon polaritons (CPPs) that occupy the tapered groove profile and propagate exclusively along the groove axis. Both GSPs and CPPs exhibit an assortment of unique properties that are highly suited to a broad range of cutting-edge nanoplasmonic technologies, including ultracompact photonic circuits, quantum-optics components, enhanced lab-on-a-chip devices, efficient light-absorbing surfaces and advanced optical filters, while additionally affording a niche platform to explore the fundamental science of plasmon excitations and their interactions. In this Review, we provide a research status update of plasmons in tapered grooves, starting with a presentation of the theory and important features of GSPs and CPPs, and follow with an overview of the broad range of applications they enable or improve. We cover the techniques that can fabricate tapered groove structures, in particular highlighting wafer-scale production methods, and outline the various photon- and electron-based approaches that can be used to launch and study GSPs and CPPs. We conclude with a discussion of the challenges that remain for further developing plasmonic tapered-groove devices, and consider the future directions offered by this select yet potentially far-reaching topic area.

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