粘附膜下脆性基体的稳态裂纹：再评
Steady-state cracking in brittle substrates beneath adherent films: revisited
摘要：
这是一个旨在重新研究双层系统中稳态开裂现象的技术说明。Suo和Hutchinson在1989年的论文中介绍的方法如下。我们的解决方案进行了比较，在该文件中出现的基板膜厚度比$λ_0=10$。我们在三个$λ_0<10$值下获得结果。结合$λ_0=10$的结果，新的一组值涵盖了1到10之间的厚度比，足以确定几乎所有相关问题中的裂纹萌生和扩展。我们在表格（和图）中呈现我们的结果，从而促进其实施和使用。
英文摘要：
This is a technical note aiming at the re-examination of the phenomenon of the steady-state cracking in the two-layer system. The method of Suo and Hutchinson, as introduced in their 1989 paper, is followed. Our solution is compared with the one appearing in that paper for the substrate-to-film thickness ratio $λ_0=10$. We obtain results at three $λ_0<10$ values. Combined with the results for $λ_0=10$, the new sets of values cover thickness ratios between 1 and 10, sufficient for determining crack initiation and propagation in almost every relevant problem. We present our results in tables (and figures), thus facilitating their implementation and use.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
