用于Tbit/s芯片互连的光子引线键合
Photonic Wire Bonds for Terabit/s Chip-to-Chip Interconnects
摘要：
在过去的几年里，光子集成已经取得了巨大的进步，具有太比特/秒数据速率的芯片级收发器系统已经实现。然而，随着片上集成密度的增加，高效的片外接口变得越来越重要。为了应对大规模光子集成带来的挑战，技术突破被认为是必不可少的，这特别适用于短距离光互连。在这封信中，我们介绍了光子引线键合的概念，其中透明波导引线键合用于桥接位于不同芯片上的纳米光子电路之间的间隙。我们首次展示了三维自由形式的光子引线键合（PWB）的制造，我们证实了它们在多太比特/秒数据传输实验中的可行性。第一代原型允许有效的宽带耦合，总损耗仅为1.6 dB。光子引线键合将实现灵活的光学多芯片组装，从而挑战当前高度复杂的单片集成模式。
英文摘要：
Photonic integration has witnessed tremendous progress over the last years, and chip-scale transceiver systems with Terabit/s data rates have come into reach. However, as on-chip integration density increases, efficient off-chip interfaces are becoming more and more crucial. A technological breakthrough is considered indispensable to cope with the challenges arising from large-scale photonic integration, and this particularly applies to short-distance optical interconnects. In this letter we introduce the concept of photonic wire bonding, where transparent waveguide wire bonds are used to bridge the gap between nanophotonic circuits located on different chips. We demonstrate for the first time the fabrication of three-dimensional freeform photonic wire bonds (PWB), and we confirm their viability in a multi-Terabit/s data transmission experiment. First-generation prototypes allow for efficient broadband coupling with overall losses of only 1.6 dB. Photonic wire bonding will enable flexible optical multi-chip assemblies, thereby challenging the current paradigm of highly-complex monolithic integration.
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