陶瓷封装大功率发光二极管的热分析和力学分析
Thermal And Mechanical Analysis of High-power Light-emitting Diodes with Ceramic Packages
摘要：
在本文中，我们提出了高功率发光二极管（LED）与陶瓷封装的热和机械分析。通过瞬态热测量和热机械模拟研究了陶瓷封装的热机械特性。通过将LED封装的塑料模具替换为陶瓷模具，从结到环境的热阻从76.1 oC/W降低到45.3 oC/W。与塑料封装相比，尽管陶瓷封装的LED的热膨胀系数失配较小，但芯片中的热机械应力水平较高。结果表明，采用陶瓷封装可以改善LED的热性能，但大功率LED陶瓷封装的安装工艺至关重要，应负责封装中界面层的分层。
英文摘要：
In this paper we present the thermal and mechanical analysis of high-power light-emitting diodes (LEDs) with ceramic packages. Transient thermal measurements and thermo-mechanical simulation were performed to study the thermal and mechanical characteristics of ceramic packages. Thermal resistance from the junction to the ambient was decreased from 76.1 oC/W to 45.3 oC/W by replacing plastic mould to ceramic mould for LED packages. Higher level of thermo-mechanical stresses in the chip were found for LEDs with ceramic packages despite of less mismatching coefficients of thermal expansion comparing with plastic packages. The results suggest that the thermal performance of LEDs can be improved by using ceramic packages, but the mounting process of the high power LEDs with ceramic packages is critically important and should be in charge of delaminating interface layers in the packages.
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