微通道内传热速率与Brinkman数的关系
Dependency of Heat Transfer Rate on the Brinkman Number in Microchannels
摘要：
随着高密度集成电路技术的出现，电子产品产生的热量增加。为了解决发热问题，微尺度冷却被认为是一种很有前途的技术。传热量的预测是微尺度冷却装置设计的关键，但目前还没有得到很好的理解。本文提出了一种新的传热率与粘度、流速和温度的无量纲数Brinkman数的关系式。本文所提出的方程可为微通道冷却装置的设计提供参考。
英文摘要：
Heat generation from electronics increases with the advent of high-density integrated circuit technology. To come up with the heat generation, microscale cooling has been thought as a promising technology. Prediction of heat transfer rate is crucial in design of microscale cooling device but is not clearly understood yet. This work proposes a new correlation between heat transfer rate and Brinkman number which is nondimensional number of viscosity, flow velocity and temperature. It is expected that the equation proposed by this work can be useful to design microchannel cooling device.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
