SERS对互连制造中铜的电化学沉积所用恒电流顺序的研究
An SERS study of the galvanostatic sequence employed for the electrochemical deposition of Copper in the fabrication of Interconnects
摘要：
本文首次报道了在聚乙二醇（PEG）、二（3-磺丙基）二硫钠盐（SPS）、苄基苯基改性聚乙烯亚胺（BPPEI）和氯离子存在下，铜在酸性硫酸盐溶液中恒电流电沉积（ECD）过程中的表面增强拉曼光谱（SERS）。在电沉积过程中记录的SERS光谱的分析允许得到一个洞察复杂的界面行为的有机共混物，在共吸附和反应性。在开路（OC）下，添加剂共吸附在铜阴极上。在增加阴极极化时，观察到PEG的逐步SPS清除作用。BPPEI在整个工艺窗口内被吸附，并鉴定了PEG的阴极反应产物。有机添加剂的联合作用产生具有亚微米尺寸的微晶的连续沉积物，如扫描电子显微镜（SEM）所示。
英文摘要：
This paper reports the first study carried out by surface-enhanced Raman spectroscopy (SERS) during the galvanostatic electrodeposition (ECD) of copper from an acidic sulphate solution, in the presence of polyethylene glycol (PEG), bis-(3-sulfopropyl)-disulfide Na salt (SPS), benzyl-phenyl modified polyethyleneimine (BPPEI) and chloride ions. The analysis of SERS spectra recorded during electrodeposition allowed to get an insight into the complex interfacial behaviour of the organic blend, in terms of co-adsorption and reactivity. At open-circuit (OC), the additives co-adsorb on the copper cathode. Upon increasing the cathodic polarization, progressive SPS-scavenging action of PEG was observed. BPPEI is adsorbed in the entire process window and cathodic reaction products of PEG were identified. The joint action of the organic additives yields a continuous deposit with crystallites of submicron dimensions, as revealed by Scanning Electron Microscopy (SEM).
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