集成电路芯片超快温度分布计算
Ultrafast Temperature Profile Calculation in Ic Chips
摘要：
集成电路设计中的关键步骤之一是最小化加热和温度不均匀性。目前的温度计算方法，如有限元分析和电阻网络有相当大的计算时间，使它们不兼容的路由和布局优化算法中使用。为了减少计算时间，我们开发了一种新的方法，认为功率模糊，用于计算温度分布，使用矩阵卷积技术与图像模糊类似。对于稳态分析，功率模糊能够预测1摄氏度以内的热点温度，计算时间比FEA快3个数量级。对于瞬态分析，计算时间对于单个脉冲增加了1000倍，对于多个频率应用增加了约100倍，同时预测热点温度在约1摄氏度内。功率模糊技术的主要优势在于它利用了硅衬底中的主要热扩散，并且它使用叠加原理。通过一个或两个有限元模拟，可以计算复杂封装的温度点扩散函数。可以使用附加的仿真来提高芯片上不同位置处的点扩散函数的精度。在此计算中，我们考虑了通过IC芯片背面和散热器的主要热传递路径。从芯片顶部通过金属化层和电路板的热传递通常是总散热量的一小部分，在此分析中被忽略。
英文摘要：
One of the crucial steps in the design of an integrated circuit is the minimization of heating and temperature non-uniformity. Current temperature calculation methods, such as finite element analysis and resistor networks have considerable computation times, making them incompatible for use in routing and placement optimization algorithms. In an effort to reduce the computation time, we have developed a new method, deemed power blurring, for calculating temperature distributions using a matrix convolution technique in analogy with image blurring. For steady state analysis, power blurring was able to predict hot spot temperatures within 1 degree C with computation times 3 orders of magnitude faster than FEA. For transient analysis the computation times where enhanced by a factor of 1000 for a single pulse and around 100 for multiple frequency application, while predicting hot spot temperature within about 1 degree C. The main strength of the power blurring technique is that it exploits the dominant heat spreading in the silicon substrate and it uses superposition principle. With one or two finite element simulations, the temperature point spread function for a sophisticated package can be calculated. Additional simulations could be used to improve the accuracy of the point spread function in different locations on the chip. In this calculation, we considered the dominant heat transfer path through the back of the IC chip and the heat sink. Heat transfer from the top of the chip through metallization layers and the board is usually a small fraction of the total heat dissipation and it is neglected in this analysis.
机构、总结、中文摘要均由AI分析而来，可能存在错误，请以论文正文为准。
