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大厂专区

Qualcomm(高通)

2026-04-22 至 2026-04-22 共收录 1
2603.08899 2026-04-22 cs.CL cs.LG

ConFu: Contemplate the Future for Better Speculative Sampling

ConFu:为更好的推测采样展望未来

Zongyue Qin, Raghavv Goel, Mukul Gagrani, Risheek Garrepalli, Mingu Lee, Yizhou Sun

机构 * University of California Los Angeles, United States(美国加州大学洛杉矶分校) Qualcomm AI Research, United States(高通人工智能研究)

AI总结 ConFu提出一种新的推测解码框架,通过引入展望令牌和软提示,使草案模型能利用目标模型的未来信号,提升生成速度和接受率。

Comments v3: Added stress test with long drafts (DL=12, top-k=1) and tail-acceptance (survival) analysis. Earlier versions added Qwen3-4B results and ablations

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